Home > Terms > English, UK (UE) > Dicing

Dicing

Process of cutting semiconductor wafer into individual chips each containing a complete semiconductor device. Large diameter wafer dicing is carried out by partially cutting the wafer along preferred crystallography planes using high precision saw with ultra-thin diamond blade.

This is auto-generated content. You can help to improve it.
0
Collect to Blossary

Member comments

You have to log in to post to discussions.

Terms in the News

Featured Terms

Harry8L
  • 0

    Terms

  • 0

    Blossaries

  • 1

    Followers

Industry/Domain: Network hardware Category:

Computer network

System of interconnected computer equipment that permits the sharing for information

Contributor

Featured blossaries

World's Top Economies in 2014

Category: Business   1 5 Terms

Top 10 Famous News Channels Of The World

Category: Entertainment   2 10 Terms

Browers Terms By Category