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Dicing
Process of cutting semiconductor wafer into individual chips each containing a complete semiconductor device. Large diameter wafer dicing is carried out by partially cutting the wafer along preferred crystallography planes using high precision saw with ultra-thin diamond blade.
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- Part of Speech: noun
- Synonym(s):
- Blossary:
- Industry/Domain: Semiconductors
- Category: Silicon wafer
- Company:
- Product:
- Acronym-Abbreviation:
Other Languages:
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