A novel technique for accurately assembling large numbers of very small devices. The small size, planarity, and accuracy of the assembly also result in very low parasitic interconnects, comparable to on die traces. This massively parallel assembly process combines the capability and flexibility of assembly with the cost effectiveness of integration. Invented by Mr. Mark Hadley and was part of his Ph.D. dissertation while he was studying at University of California, Berkley. The FSA process became the foundation for the origins of a new company named Alien Technology Corporation. In the FSA process, specifically shaped semiconductor devices ranging in size from 10 microns to several hundred microns are suspended in liquid and flowed over a surface which has correspondingly shaped "holes" or receptors on it and into which the devices settle. The shape of the devices and of the holes is designed so that the devices fall easily into place and are selfaligning. Alien has successfully demonstrated the assembly of tens of thousands of devices in a single process step.