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Test equipment

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Test equipment

Corner frequency (Fc)

Semiconductors; Test equipment

The transition frequency range between the PASS-BAND and STOP-BAND. For Butterworth and Bessel type philtres this would be the frequency where the signal is –3.01 dB with reference to the PASS-BAND ...

Silicon wafer fabrication facility (fab)

Semiconductors; Test equipment

The manufacturing plant in which blank silicon wafers are processed to create finished wafers. A wafer is a round slice of a silicon ingot on which many chips are manufactured simultaneously.

Femto (F)

Semiconductors; Test equipment

A unit of measure, typically used in expressing capacitance. One femto Farad (fF) is equal to 0.000000000000001 Farad. In other words it is one thousandth of one millionth of one millionth, or 10-15.

Isolation and remediation metrics fault detection (FDIR)

Semiconductors; Test equipment

Metrics that quantify the likelihood that a fault will be detected, isolated and remediated.

Farad (F)

Semiconductors; Test equipment

The basic unit of capacitance. One Farad, however, is so large that in most electronics circuits microFarad (uF) and picoFarad (pF) capacitors are more common.

Flip chip attach (FCA)

Semiconductors; Test equipment

The technique of attachment of an IC chip to a substrate using solderable bumps between the silicon chip and substrate.

Equipment under test (EUT)

Semiconductors; Test equipment

The electronic device which is currently tested for immunity or emission.

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