10 Terms
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Test equipment
Industry: Semiconductors
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Test equipment
Pipeline operation altering thread (PAT)
Semiconductors; Test equipment
A pre-compiled list of PC ImageFlow operations which define a particular collection of pipelined operations. PATs can be executed extremely quickly and are used to configure and reconfigure image ...
Pico (P)
Semiconductors; Test equipment
Representing one millionth of one millionth = 0.000 000 000 001 or 10 to the -12th power. Typically used for capacitance measurements, such as 5 pF is 5*10^-12 farads.
Plastic ball grid array (PBGA)
Semiconductors; Test equipment
A ball grid array component whose package substrate is made of plastic, most likely an FR-4 equivalent of epoxy-fiberglass, polyimide-arramid, or similar resin-fiber combinations.
Positive bias temperature instability (PBTI)
Semiconductors; Test equipment
A failure mechanism in ICs that is similar to NBTI, except that it happens on a PFET rather than an NFET
Personal area network (PAN)
Semiconductors; Test equipment
A term popularised to describe how Bluetooth enables a collection of personal electronic devices to operate together as a logical collective.
Printed circuit assembly (PCA)
Semiconductors; Test equipment
The generic term for a PCB after all electrical components have been attached. Also referred to as a printed wiring assembly (PWA).
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